Team Group XTREEM memory module 48 GB 2 x 24 GB DDR5 288-pin DIMM ECC

SKU
FFXD548G7600HC36EDC01
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In Stock: 10 available
48 GB (2x 24 GB), DDR5, 7600 MHz, 288-pin, 1.4 V
  • Honorable T-FORCE Logo exceeds overclocking limits
  • Meticulously layered high-quality aluminum sandblasted fin for exceptional heat dissipation
  • Sturdy 2mm heat spreader for perfect heat dissipation improvement
  • High-quality IC with the patented technique
  • Power management chip for stable and effective power usage
  • On-Die ECC for a more stable system
More Information
Internal memory type DDR5
Memory clock speed 7600 MHz
ECC Yes
Memory form factor 288-pin DIMM
SKU FFXD548G7600HC36EDC01
EAN 4711430800868
Manufacturer Team Group
Availability In Stock
Product Family XTREEM
Product Manuals (HTML) View Manual
Honorable T-FORCE Logo exceeds overclocking limits
With T-FORCE LAB’s superb R&D capability, the brand-new T-FORCE XTREEM DDR5 exceeds the frequency limit of DDR5 memory. The product has T-FORCE logo symbolizing our utmost pride, showcasing its exceptional existence, it is definitely the best choice in the world of overclocking products.

Meticulously layered high-quality aluminum sandblasted fins for exceptional heat dissipation
Inspired by the image of energy conversion between the hot and cold under high temperatures from a volcano, the exterior and looks of T-FORCE XTREEM DDR5 has meticulously layered high-quality aluminum sandblasted fins resembling the texture of basalt and the beach, delivering exceptional heat dissipation capabilities. The surface is etched with T-FORCE logo to certify its excellence.

Sturdy 2mm heat sink for perfect heat dissipation improvement
T-FORCE XTREEM DDR5 adopts 2mm aluminum alloy heat spreader to increase its quality and heat capacity. The product also has thermal gap pad with high thermal conductivity to strengthen PMIC heat dissipation effects, coupled with anti-acid, alkaline, rust and inconducive anodic treatment on the surface to deliver perfect heat dissipation performance overall.

High-quality IC with patented technique
Uses our proprietary IC grading testing validation technique—GRADING METHOD FOR MEMORY (Invention patent number in Taiwan: I751093; Invention patent number in USA: US11488679B1) to develop DDR5 high-performance memory module successfully.

Power management chip for stable and effective power usage
Power management chip minimizes noise interference, stabilizes power and distributes power to each electronic component effectively, supplying power to the system with stability and fastness.

On-Die ECC for a more stable system
Supported with On-die ECC providing error correction and detection, the mechanism stabilizes the system while pursing performance.
Memory
Package typeBox
Buffered memory typeRegistered (buffered)
Memory layout (modules x size)2 x 24 GB
Internal memory48 GB
Component forPC
Memory form factor288-pin DIMM
CAS latency36
Memory voltage1.4 V
ECCYes
Memory clock speed7600 MHz
Internal memory typeDDR5
Power
Memory voltage1.4 V
Design
Cooling typeHeatsink
Technical details
Cooling typeHeatsink
Features
On-Die ECCYes
Buffered memory typeRegistered (buffered)
Memory layout (modules x size)2 x 24 GB
Internal memory48 GB
Component forPC
Memory form factor288-pin DIMM
CAS latency36
Memory voltage1.4 V
Cooling typeHeatsink
ECCYes
Memory clock speed7600 MHz
Internal memory typeDDR5
Weight & dimensions
Width8.2 mm
Depth134.5 mm
Height48.8 mm
Package typeBox
Packaging data
Package typeBox

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SKU
FFXD548G7600HC36EDC01
95Y4808
708643-B21
708643-S21
815100-B21
815101-B21
Manufacturer
Team Group
Lenovo
HPE
HPE
HPE
HPE
ECC
Y
N/A
Y
N/A
Y
Y
Internal memory type
DDR5
DDR4
DDR3
DDR3
DDR4
DDR4
Memory form factor
288-pin DIMM
288-pin DIMM
240-pin DIMM
240-pin DIMM
288-pin DIMM
288-pin DIMM
Component for
PC
N/A
PC/server
PC/server
PC/server
PC/server
Internal memory
32GB
32GB
32GB
32GB
32GB
64GB
Memory layout (modules x size)
2 x 24 GB
1 x 32 GB
1 x 32 GB
1 x 32 GB
1 x 32 GB
1 x 64 GB