Team Group VULCAN FLBD532G6000HC30DC01 memory module 32 GB 2 x 16 GB DDR5

SKU
FLBD532G6000HC30DC01
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In Stock: 214 available
32 GB, DDR5, Aluminum heat-sink
  • Sleek Design
  • Reinforced Structure for Better Cooling
  • Supports Intel XMP3.0 for One-Click Overclocking
  • Power Management ICs (PMICs) Equipped for Stable, Efficient Power Usage
  • Strengthened PMIC Cooling Design
  • On-die ECC for Stable Systems
  • High-Quality ICs Selected for Stability & Reliability
More Information
SKU FLBD532G6000HC30DC01
EAN 0765441868700
Manufacturer Team Group
Availability In Stock
Product Family VULCAN
Product Manuals (HTML) View Manual
Sleek Design
For the T-FORCE VULCAN DDR5, TEAMGROUP has adopted a gorgeous streamlines design with multi-angular to overall outline for visual aesthetics and showcase VULCAN DDR5's unique features, delivering a sleek OC gaming memory that packs a powerful performance.

Reinforced Structure
The VULCAN DDR5 is molded from a single block of aluminum alloy through stamping and the top structure is fixed with a snap fastener.

Better Cooling
TEAMGROUP uses a professional-grade thermal conducting silicon to reinforce adhesion between the cooling fin and memory. The silicon also allows for incredible cooling as it transfers the heat from top to bottom rapidly, ensuring that the memory remains at the optimal operating temperature.

Supports Intel XMP3.0 for One-Click Overclocking
Supports the latest Intel XMP3.0 and one-click overclocking technology; users can experience ultra-fast overclocking speeds at a single click.

Strengthened PMIC Cooling Design
The VULCAN DDR5 is equipped with professional thermal conductive silicon, make PMIC cooling design for more effective, and stable PMIC operations.

Power Management ICs (PMICs) Equipped for Stable, Efficient Power Usage
The VULCAN DDR5 memory is equipped with PMIC, minimizing noise interference ensuring stable, efficient power distribution across all components for rapid, and reliable power supply.

On-die ECC for Stable System
The VULCAN DDR5 memory supports on-die ECC, which offers error correction and detection to ensure that system stability is not compromised for performance.

High-Quality ICs Selected for Stability & Reliability
TEAMGROUP has selected a high-quality IC die that has undergone comprehensive compatibility and reliability testing to ensure an OC gaming memory that delivers both stability and compatibility.
Power
Memory voltage1.35 V
Design
Product colourBlack
Cooling typeHeatsink
Technical details
Product colourBlack
Cooling typeHeatsink
Sustainability complianceYes
Compliance certificatesCE, RoHS, UKCA
Memory
Buffered memory typeUnregistered (unbuffered)
Intel Extreme Memory Profile (XMP)Yes
Intel Extreme Memory Profile (XMP) version3.0
Memory layout (modules x size)2 x 16 GB
Internal memory32 GB
Component forPC
Memory form factor288-pin DIMM
CAS latency30
Memory voltage1.35 V
ECCNo
Memory clock speed6000 MHz
Internal memory typeDDR5
Features
On-Die ECCYes
Buffered memory typeUnregistered (unbuffered)
Intel Extreme Memory Profile (XMP)Yes
Intel Extreme Memory Profile (XMP) version3.0
Product colourBlack
Memory layout (modules x size)2 x 16 GB
Internal memory32 GB
Component forPC
Memory form factor288-pin DIMM
CAS latency30
Memory voltage1.35 V
Cooling typeHeatsink
ECCNo
Memory clock speed6000 MHz
Internal memory typeDDR5
Sequential bandwidth - 100% read (up to)48000 MB/s
Sustainability
Sustainability complianceYes
Weight & dimensions
Width7.5 mm
Depth140 mm
Height32.7 mm

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SKU
FLBD532G6000HC30DC01
95Y4808
CMK16GX4M1A2666C16
799087-361
799087-971
799087-961
Manufacturer
Team Group
Lenovo
Corsair
HP
HP
HP
ECC
N
N/A
N
N/A
N/A
N/A
Internal memory type
DDR5
DDR4
DDR4
DDR4
DDR4
DDR4
Memory form factor
288-pin DIMM
288-pin DIMM
288-pin DIMM
260-pin SO-DIMM
260-pin SO-DIMM
260-pin SO-DIMM
Component for
PC
N/A
PC/server
Notebook
Notebook
Notebook
Internal memory
32GB
32GB
N/A
8GB
8GB
8GB
Memory layout (modules x size)
2 x 16 GB
1 x 32 GB
1 x 16 GB
N/A
N/A
N/A